adhesion

adhesion to the party

adhesion to the protocol

adhesion of a locomotive

the adhesion of the gum strip to the paper.

give one’s adhesion to

Cell adhesion is an important physiological process, most types of metazoic cells rely on adhesion to surfaces to carry out their functions.

4 In multicoat systems adhesion failure may occur betweennbspnbspcoats so that the adhesion of the coating system to thenbspnbspsubstrate is not determined.

he was harshly criticized for his adhesion to Say's law.

Prescription 8 skills queens adhesion , cheloid , chronic inflammation.

Objective To evaluate the effects of fibrin glue and gatifloxacin on preventing adhesion and local infection of tendon after tenorrhaphy.

It is found that incorporation of a trifunctional carboxylic ester or silane coupling agent can improve the adhesion of coatings on glass.

At the same time a good adhesion and abrasion-proof, corrosion resistance and weatherable eqripjment.

To improve adhesion of copper, all conductors should have rounded corners , not mitred or right-angled, especially in dynamic or bend areas.

E-cadherin, as a cell adhesion molecule containing high mannose type N-linked glycan, mediates homotypic cell adhesion.

Adhesion &Scour, Low absorbs moisture, Good penetrativity, Flexibility, Rarely falling glue, Non effect for coloration, scour &finish.

Results There were 10 cases of middle turbinal and nasal lateral wall adhesion and 5 cases of middle and inferior turbinal adhesion.

Objective: To explore the prevention of adhesion of uterine cavity or endocervical canal by installation of T type intrauterine device after hysteroscopic electroresection.

Moreover, the blood compatibility of PDMS/O-MMT nanocomposites was evaluated by hemolysis test, recalcification time and platelet adhesion test.

Conclusion Medical Chitosan to be used for prevent postoperative adhesion before closed up the incision was effective and it was ideal biotical material for prevent postoperative adhesion.

Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, "A Study on the Adhesion Between EMC and IC Encapsulation Mold", Automation Conference, P180 (2003).